The $300M Microcap Building the Machines for the Glass-Substrate Revolution

A panel-level packaging and glass-substrate equipment supplier on my watchlist

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Introduction

In this article, I’ll examine a micro-cap semiconductor equipment company selling into the PCB, panel-level packaging, and glass-substrate supply chains, with companies such as TSMC, Samsung, and Intel as end customers.

This company is exposed to both glass substrates and panel-level packaging, the two revolutions coming to semiconductor manufacturing that every investor should be aware of.

I’ve been mapping these supply chains across several articles, as I believe they will produce multiple multibaggers as the technologies move from trials, where they are today, to mass-scale production over the coming years.

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