My New Watchlist Stock: A $300M Glass-Substrate Microcap
A panel-level packaging and glass-substrate equipment supplier on my watchlist
Introduction
In this article, I’ll examine a micro-cap semiconductor equipment company selling into the PCB, panel-level packaging, and glass-substrate supply chains, with companies such as TSMC, Samsung, and Intel as end customers.
This company is exposed to both glass substrates and panel-level packaging, the two revolutions coming to semiconductor manufacturing that every investor should be aware of.
I’ve been mapping these supply chains across several articles, as I believe they will produce multiple multibaggers as the technologies move from trials, where they are today, to mass-scale production over the coming years.